Responsibilities Include:
Evaluate new product designs through the use of ATE and advanced bench testing equipment.
Develop ATE solutions for wafers and package level test
Work with design engineers to debug and define optimal ATE test solutions
Work closely with the manufacturing sites to ensure cost effective manufacturing is considered during the development of new products
Define new test platform and equipment requirements when appropriate.
Work with other division test groups to identify and implement best practices in test and characterization.
Support outside test resources if/when this approach is chosen for any new project.
Attend relevant test conferences, industry shows, and/or seminars to keep abreast of industry testing standards, etc.
Qualifications:
3+ years of semiconductor test experience (DFT, characterization & production test). Prefer experience in high performance mixed signal and Flash memroy
Experience developing test solution is required;
Experience in device characterization is required.
Familiar with ATE software programming with VC/VB;
Proficiency with PCB Design tools and skill on PCB design and assembly are required;
Strong experience in lab with test equipment like oscilloscope, generator, network analyzer etc;
BSEE or equivalent
Experience working with subcon test groups is desirable.
Good interpersonal skills to work in a team environment.
Good communications and presentation skills. Ability to speak in front of technical groups, customers, etc..
Ability and experience to work with key customers on advanced testing techniques, strategies, methodologies, etc..
Good writing skills. Willingness to write technical articles for industry journals and internal publications.
